HOME
ABOUT
ENVIRONMENT
JOIN YIXUAN
PRODUCT
ABB
Allen-Bradley
ADEPT
Alfa Laval
ALSTOM
AREA
Chip electronics
Industrial control
Drone shielding and signal detection
STRENGTH
NEWS
CONTACT
HOME
ABOUT
ENVIRONMENT
JOIN YIXUAN
PRODUCT
ABB
Allen-Bradley
ADEPT
Alfa Laval
ALSTOM
AREA
Chip electronics
Industrial control
Drone shielding and signal detection
STRENGTH
NEWS
CONTACT
✕
HOME
ABOUT
ENVIRONMENT
JOIN YIXUAN
PRODUCT
ABB
Allen-Bradley
ADEPT
Alfa Laval
ALSTOM
AREA
Chip electronics
Industrial control
Drone shielding and signal detection
STRENGTH
NEWS
CONTACT
中文版
400-887-3214
CHIP ELECTRONIC COMPONENTS
Infinite innovation, the future of chip systems
PRODUCT
POSITION:
HOME
—
PRODUCT
—SEG MR13
ABB
Allen-Bradley
ADEPT
Alfa Laval
ALSTOM
AMAT
B&R
BACHMANN
BENTLY
Bosch Rexroth
Rexroth
BAILEY
CUTLER-HAMMER
DEIF
DANAHER
Enterasys
Extreme
EATON
ELAU
EMERSON
EPRO
FANUC
FOXBORO
GE
HIMA
Honey Well
ICSTriplex
IFM
Kollmorgen
SIEMENS
Schneider
WOODWARD
YASKAWA
Omron
YOKOGAWA
MOOG
MOTOROLA
NI
RELIANCE
SEW
TRICONEX
Schenider
Weidmueller
Mitsubishi
SICK
other
SEG MR13
The Woodward SEG MR13 is a marine-certified digital governor designed for precision engine control in harsh maritime environments, meeting stringent classification society requirements.
400-887-3214
DESCRIBE
Woodward SEG MR13 MRI Sequence Technical Description
Sequence Type: Specialized Spin-Echo Gradient (SEG) sequence
Field Strength: Typically 1.5T or 3T systems
Vendor Implementation: Woodward MRI protocol (vendor-agnostic)
Key Parameters:
MR13 Encoding:
Utilizes a 13-point k-space sampling scheme
Optimized for balanced contrast-to-noise ratio
Features partial Fourier acquisition (5/8 partial Fourier)
Contrast Characteristics:
Proton density-weighted with T2 influence
TR: 2000-2500 ms (adjustable)
TE: 25-35 ms (short echo time variant)
Spatial Resolution:
Matrix: 256 × 192 (interpolated to 512)
FOV: 220-240 mm (adjustable)
Slice thickness: 3-4 mm with 0.5 mm gap
Special Features:
Integrated flow compensation gradients
Adaptive parallel imaging (GRAPPA factor 2)
Multi-slab acquisition capability
Clinical Applications:
High-resolution musculoskeletal imaging
Small joint evaluation (wrist, ankle)
Cartilage assessment
Tendon and ligament visualization
Technical Advantages:
Enhanced edge definition for anatomical structures
Reduced susceptibility artifacts compared to standard SE
Optimized scan time (typically 4-6 minutes)
Excellent fat-suppression performance
Protocol Optimization Notes:
For 3T systems: Reduce flip angle by 15-20% to maintain contrast
For metal artifact reduction: Increase bandwidth by 20%
Pediatric applications: May reduce matrix to 192 × 160
Quality Assurance Parameters:
Minimum SNR requirement: ≥18 dB
Artifact tolerance: ≤3% of FOV
Slice profile accuracy: ±0.3 mm
Easy Semiconductor Technology (Hong Kong) Limited 易擇半導體科技(香港)有限公司
吉ICP备2024020526号-1
HOME
PRODUCT
TEL
MESSAGE
js