创新无限，芯系未来
Infinite innovation, the future of chip systems
Technical parameters
Access time (Max) 3500 ns
Working temperature (Max) 85 ℃
Working temperature (Min) -40 ℃
Power supply voltage 1.8V~5.5V
Encapsulation parameters
Pin count 8
Encapsulation TSSOP-8
External dimensions
Encapsulation TSSOP-8
Physical parameters
Working temperature -40 ℃~85 ℃ (TA)
other
Product lifecycle unknown
Packaging Method Tape&Reel (TR)
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