创新无限,芯系未来
Infinite innovation, the future of chip systems
Technical parameters
Access time 120 ns
Memory capacity 64000 B
Access time (Max) 120 ns
Working temperature (Max) 85 ℃
Working temperature (Min) -40 ℃
Power supply voltage 4.5V~5.5V
Encapsulation parameters
Installation method through Hole
Pin count 32
Encapsulation PDIP-32
External dimensions
Length 42.4 mm
Width 14.73 mm
Height 4.95 mm
Encapsulation PDIP-32
Physical parameters
Working temperature -40 ℃~85 ℃ (TA)