创新无限，芯系未来
Infinite innovation, the future of chip systems
Technical parameters
Memory capacity 32 B
Working temperature (Max) 85 ℃
Working temperature (Min) -40 ℃
Power supply voltage 4.5V~5.5V
Encapsulation parameters
Installation method: Surface Mount
Pin count 8
Encapsulation SOIC-8
External dimensions
Length 5 mm
Width 4 mm
Height 1.5 mm
Encapsulation SOIC-8
Physical parameters
Working temperature -40 ℃~85 ℃ (TA)
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