CHIP ELECTRONIC COMPONENTS
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technical parameter
Working voltage 5.5 V
Capacitor 0.95 pF
Pin count 2
Clamp voltage 24 V
Test current 1 mA
Maximum reverse breakdown voltage 9.1 V
Pulse peak power 67 W
Minimum reverse breakdown voltage 7.5 V
Working temperature (Max) 125 ℃
Working temperature (Min) -40 ℃
Encapsulation parameters
Installation method: Surface Mount
Pin count 2
Encapsulation XDFN-2
External dimensions
Height 0.4 mm
Encapsulation XDFN-2
Physical parameters
Working temperature -40 ℃~125 ℃ (TA)