Technical parameters
Halogen free state
Access time (Max) 75 ns
Working temperature (Max) 125 ℃
Working temperature (Min) -40 ℃
Encapsulation parameters
Installation method: Surface Mount
Pin count 8
Encapsulation SOIC-8
External dimensions
Encapsulation SOIC-8
Physical parameters
Working temperature -40 ℃~125 ℃
other
Product lifecycle Active
Packaging Method Tape&Reel (TR)
Manufacturing applications Industrial Systems, Computer Systems, Commu