Technical parameters
Pin count 20
Dissipative power of 500 mW
Working temperature (Max) 85 ℃
Working temperature (Min) -40 ℃
Dissipative power (Max) 500 mW
Power supply voltage 2V~6V
Power supply voltage (Max) 6 V
Power supply voltage (Min) 2 V
Encapsulation parameters
Installation method: Surface Mount
Pin count 20
Encapsulation SOIC-20
External dimensions
Length 13.01 mm
Width 7.595 mm
Height 2.34 mm
Encapsulation SOIC-20
Physical parameters
Working temperature -40 ℃~85 ℃