CHIP ELECTRONIC COMPONENTS
Infinite innovation, the future of chip systems
Technical parameters
Halogen free state
Number of channels 8
Number 8
Dissipative power of 180 mW
Working temperature (Max) 85 ℃
Working temperature (Min) -40 ℃
Dissipative power (Max) 180 mW
Power supply voltage 2V~3.6V
Encapsulation parameters
Installation method: Surface Mount
Pin count 20
Encapsulation SOIC-20
External dimensions
Encapsulation SOIC-20
Physical parameters
Working temperature -40 ℃~85 ℃ (TA)