CHIP ELECTRONIC COMPONENTS
Infinite innovation, the future of chip systems
Technical parameters
Number of output interfaces 8
Number of channels 8
Dissipative power of 500 mW
Input number 8
Working temperature (Max) 125 ℃
Working temperature (Min) -55 ℃
Dissipative power (Max) 500 mW
Power supply voltage 2V~6V
Encapsulation parameters
Installation method: Surface Mount
Pin count 20
Encapsulation SOIC-20
External dimensions
Encapsulation SOIC-20
Physical parameters
Working temperature -55 ℃~125 ℃ (TA)