创新无限,芯系未来
Infinite innovation, the future of chip systems
Core competencies POSITION:HOMECore competencies—PCB R&D capability
PCB R&D capability

  1.**Circuit Design and Simulation**

  Ability to design complex circuits using professional EDA(Electronic Design Automation)software,including analog circuits,digital circuits,mixed signal circuits,etc.During the design process,simulation analysis will be conducted to ensure that the circuit performance meets expectations.

  2.Layout and wiring**

  Layout PCB according to circuit design,arrange component positions reasonably,optimize wiring paths,and reduce signal interference and electromagnetic radiation.This requires profound knowledge of electromagnetic compatibility(EMC)and signal integrity(SI).

  3.**Material selection and cost control**

  Enable customers to understand the impact of different substrates(such as FR-4,metal substrates,etc.),copper foil thickness,solder mask layer,and surface treatments(such as gold plating,tin spraying,etc.)on PCB performance,facilitating cost control while meeting performance requirements.

  4.**Manufacturing process optimization**

  Familiar with various aspects of PCB manufacturing,including drilling,electroplating,lamination,etching,etc.,able to propose manufacturing process optimization solutions based on design requirements,improve production efficiency and quality.

  5.**DFM(Design for Manufacturing)capability**

  Consider the feasibility and efficiency of manufacturing during the design phase to avoid production delays and cost increases caused by design errors.

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